Chemical Mechanical Polish的意思|示意
化学机械抛光
Chemical Mechanical Polish的网络常见释义
化学机械研磨 本文通过对半导体制造工艺中化学机械研磨（chemical mechanical polish）工艺中的研磨环、氨水和纯水的使用分析，提出晶圆厂物料循环使用..
Chemical Mechanical Polish相关短语
1、 chemical-mechanical polish 化学坏抛光法一种去掉圆片表面某种物质的方法
Chemical Mechanical Polish相关例句
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。