Flip Chip Technology的意思|示意
倒装芯片技术
Flip Chip Technology的网络常见释义
倒装焊技术 采用底充胶(underfill)工艺、倒装焊技术(flip chiP technology)的封装结构随着信息产业的飞速增 长，近年来得到了广泛的应用[s，7].
倒装芯片技术 ...信息产品不断朝着微型化、低成本、多功能、便 携式以及高可靠性等方向迅猛发展，进而推动了倒装芯片技术（Flip Chip Technology） 在微电子封装中的应用并成为新一代晶圆级封装的主流技术 [3] 。
Flip Chip Technology相关短语
1、 FCT-Flip Chip Technology 技术
2、 flip-chip technology 倒装式芯片技术
3、 Flip-Chip Bonding Technology 覆晶组装技术
Flip Chip Technology相关例句
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。