chemical vapor deposition film的意思|示意

Plasma enhanced chemical vapor deposition (PECVD) technique is the primary method which is used to prepare hydrogenated silicon film.

等离子体化学气相沉积技术制备氢化硅薄膜工艺条件成熟稳定而成为薄膜制备的首选方法。

This article is about how to use Electron Cyclotron Resonance Chemical Vapor Deposition (ECRCVD) method to prepare amorphous silicon nitride (SiN_x) film.

探讨如何用电子回旋共振化学气相沉积(ECRCVD)设备制备非晶态氮化硅介质膜和光学膜。

A new kind of silicon oxidic film on aluminum was prepared by chemical vapor deposition (CVD) in ambient pressure.

本研究采用常压化学气相沉积（CVD）的方法在金属铝基底上制备出硅氧化合物陶瓷膜层。

Plasma enhanced chemical vapor deposition (PECVD) is one of the matured and simple manipulated among the thin film deposition methods at low temperature.

等离子增强化学气相沉积(PECVD)是低温沉积硅膜的主要方法。

In this paper, prevailing TBC deposition technologies, including plasma spray, electron beam-physical vapor deposition, ion beam assisted film deposition and chemical vapor deposition, are reviewed.

综述了热障涂层研究及应用中的几种主要制备技术，包括等离子喷涂、电子束物理气相沉积、离子束辅助沉积、化学气相沉积等。

Making use of physical or chemical vapor deposition to accumulate to plate the film mutually and reinforces the surface of work strength.

利用物理或者化学气相沉积镀膜，增加工件表面强度。