die chip的意思|示意
死的芯片
die chip的网络常见释义
崩片 ...刊网 免费论文下载 关键词: 超薄圆片 崩片 背崩 正面崩片 崩裂 划片刀过载[gap=1072]Key words: ultrathin wafer; die chip; backside chip; topside chip; die chip and crack; blade overloading ..
die chip相关短语
1、 die chip and crack 崩裂
2、 stacked die chip 叠层芯片
3、 stacked-die chip scale package 叠层芯片尺寸封装
die chip相关例句
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.
该系统可以处理直径多达200毫米的晶片，包括模具的倒装。
Testing the "system on a chip" Much has been written about the concept of a "system on a chip," the ever-increasing integration of logic and analog functions on one silicon die or chip.
测试芯片上的“系统”很多人已写了一个“片面系统”的概念，逻辑和模拟功能不断增长的集成在一个硅芯片或芯片。
Antagonizing a bear with a chocolate chip cookie or ballet dancing on the beach during a tsunami is a stupid way to die.
用巧克力饼干激怒一只熊或在海啸时的海滩上跳芭蕾是一个愚蠢的死亡方法。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。