flip-chip的意思|示意

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性.

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In summary, dry film photo - resist was applied to the wafer level high frequency flip - chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

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To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.

热超声倒装键合作为前沿封装技术具有良好的发展前景.

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With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.

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Underfill technology effectively enhances the flip - chip cycle fatigue life and reliability of packaging process.

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.

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In the aspect of dispersion for power LEDs, flip - chip configuration has potential predominance.

与正装LED相比, 倒装焊芯片技术在功率型LED的散热方面具有潜在的优势.

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