flip chip的意思|示意

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性.

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In summary, dry film photo - resist was applied to the wafer level high frequency flip - chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

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To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.

热超声倒装键合作为前沿封装技术具有良好的发展前景.

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The purpose of this thesis is to apply dry film photo - resist for high frequency flip - chip packaging .

本论文研究的方向是将乾膜 光阻 应用于高频 覆晶封装 上.

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With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.

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The sensor chip is flip - chip packaged on a thin ceramic substrate using copper pillar bump technology.

该传感器使用铜柱凸点技术,倒装于薄层陶瓷上.

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