plating through hole的意思|示意
电镀通孔
plating through hole的网络常见释义
镀通孔 ...核心层之中，以加有玻璃纤维的树脂板为中心，再让绝缘层和铜镀金电路交织而成，此类构造需要使用电镀通孔(Plating Through Hole)，导致核心层的设计自由度降低。
通孔 (8) PTH : 电镀的导通孔(Plating Through Hole)。
plating through hole相关短语
1、 Non-plating Through Hole Board 非孔化印制板
2、 Plating-through-hole Board 孔化印制板
3、 Non Plating Through Hole 沉铜孔
plating through hole相关例句
The technology of the plating through hole of the printed circuit board was briefly introduced the plating through hole technology of the microwave printed circuit board were also illuminated.
本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
已经到达上端的电镀液穿过管状电极的通孔循环。