low temperature bonding的意思|示意
低温粘合
low temperature bonding的网络常见释义
低温键合 ...;低温键合 [gap=16205]Key words:silicon photonics;optical interconnect;heterogeneous integration;low temperature bonding ...
low temperature bonding相关短语
1、 Low temperature bonding strength 低温粘结强度
2、 low temperature metallic bonding 低温金属键合
3、 low temperature wafer bonding 低温晶片键合
low temperature bonding相关例句
The article presents advantages of the dry heat technology, adhesives available, benefits of low temperature bonding and important parts in a laminating machine.
本文介绍了干热层合技术的优点，可供使用的粘合剂、低温粘合的优点及层合机的组成。
Conclusion: Low temperature plasma treatment might be used to improve the surface wettability and bonding strength of denture base acrylic resin.
结论：低温等离子体处理树脂材料表面可提高其润湿性及粘接性。
Bonding products and strong, fast drying, storage of non-hierarchical, not precipitation, low-temperature performance and resistance.
产品粘接力强、干燥速度快、存放不分层、不沉淀、耐低温性能好。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
This product is a two-component reactive adhesives, This product has good high and low temperature properties, bonding strength and anti-aging properties.
本产品为双组份反应型粘合剂，本产品具有良好的高低温性能、粘结强度和耐老化性能。