Temperature bonding的意思|示意

美 / / 英 / /

焊接温度


Temperature bonding的网络常见释义

粘合温度 ... 辊式Roller Type 粘合温度Temperature bonding 粘合宽度Width for bonding ...

Temperature bonding相关短语

1、 Room temperature bonding 常温粘结 ; 室温键合

2、 Normal temperature bonding 常温粘结

3、 low temperature bonding 低温键合

Temperature bonding相关例句

Transient liquid phase (TLP) bonding was applied to join TP304H stainless pipe, and the effect of bonding temperature on joint microstructure and mechanical properties was studied.

采用瞬时液相扩散焊(TLP)连接技术进行了TP 304 H不锈钢管的焊接,分析了不同焊接温度对接头组织、成分和力学性能的影响。

However, the preheating temperature should not be too high, so as to avoid matrix effects of surface oxidation and surface coating and the substrate bonding strength.

但预热温度不宜过高,以免引起基体表面氧化而影响涂层与基体表面的结合强度。

Results showed that the high temperature adhesive cured at room temperature had satisfied bonding performance for graphite materials.

结果表明,室温固化型高温粘结剂对石墨材料具有良好的粘接性能。

The results prove that the initial bonding strength mostly depends on total reduction and heating temperature of al.

结果表明,轧制变形程度和铝层加热温度都是影响复合板初结合强度的主要因素。

Laser localized bonding is an important technology to reduce the high temperature adverse effect in bonding process.

激光局部键合是有效降低键合温度的一种重要工艺。

In process parameters, the rf power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.

工艺参数中,射频功率和压强综合影响了基元数量、能量以及成分,基片温度主要影响表面扩散、原子成键。